Gigabyte GeForce RTX™ 5060 Ti WINDFORCE OC 16G, 2587 MHz, CUDA TBD, 28 Gbps, GDDR7, 128 bit, PCI-E 5.0, PSU 650W, DisplayPort 2.1b *3 HDMI 2.1b *1
SPECIFICATION
Graphics Processing
GeForce RTX™ 5060 Ti
Core Clock
2587 MHz (Reference card :2572 MHz)
CUDA® Cores
TBD
Memory Clock
28 Gbps
Memory Size
16 GB
Memory Type
GDDR7
Memory Bus
128 bit
Card Bus
PCI-E 5.0
Digital max resolution
7680x4320
Multi-view
4
Card size
L=208 W=120 H=40 mm
PCB Form
ATX
DirectX
DirectX 12 API
OpenGL
4.6
Recommended PSU
650W
Power Connectors
8 Pin*1
Output
DisplayPort 2.1b *3
HDMI 2.1b *1
Accessories
Quick guide
FEATURES
Powered by the NVIDIA Blackwell architecture and DLSS 4
Powered by GeForce RTX™ 5060 Ti
Integrated with 16GB GDDR7 128bit memory interface
WINDFORCE cooling system
Hawk fan
Server-grade Thermal conductive gel
Reinforced structure
The Ultimate Platform for Gamers and Creators
Fifth-Gen Tensor Cores
Max AI performance with FP4 and DLSS 4
New Streaming Multiprocessors
Optimized for neural shaders
Fourth-Gen Ray Tracing Cores
Built for Mega Geometry
WINDFORCE
COOLING SYSTEM
The WINDFORCE cooling system delivers exceptional thermal performance through a combination of cutting-edge technologies. It features server-grade thermal conductive gel, innovative Hawk fans with alternate spinning, composite copper heat pipes, a copper plate, 3D active fans, and screen cooling.
HAWK FAN
The Hawk Fan features a unique blade design inspired by the aerodynamics of an eagle's wing. This design reduces air resistance and noise levels, resulting in up to a 53.6% increase in air pressure and a 12.5% increase in air volume without compromising acoustics.
GRAPHENE NANO LUBRICANT
Graphene nano lubricant can extend the life of sleeve bearing fan by 2.1 times, close to the life of double ball bearing, and is quieter.
ALTERNATE SPINNING
Reduce the turbulence of adjacent fans and increase airflow pressure.
3D ACTIVE FAN
The 3D Active Fan provides semi-passive cooling, and the fans will remain off when the GPU is in a low load or low power game.
SERVER-GRADE THERMAL CONDUCTIVE GEL
To enhance product quality and reliability, we have introduced server-grade thermal conductive gel for cooling critical components such as VRAM and MOSFETs. This highly deformable, non-fluid gel provides optimal contact for uneven surface and effectively resists deformation from transport or long-term use, unlike traditional thermal pads.
COPPER PLATE & COMPOSITE COPPER HEAT PIPE
The copper plate directly contacts the GPU, coupled with the composite copper heat pipes, which quickly transfers the heat of the GPU and VRAM to the heatsink.
SCREEN COOLING
Extended heatsink allows air to pass through, providing better heat dissipation.
REINFORCED STRUCTURE
The reinforced metal backplate securely fastened to the I/O bracket, provides exceptional structural integrity.
